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16 Mbps, ESD Protected, Full-Duplex RS-485 Transceivers ADM1490E/ADM1491E
FEATURES
RS-485/RS-422 full-duplex transceiver for high speed motor control applications 16 Mbps data rate 8 kV ESD protection on RS-485 input/output pins Complies with ANSI/TIA/EIA-485-A-1998 Open circuit fail-safe Suitable for 5 V power supply applications 32 nodes on the bus (1 unit load) Thermal shutdown protection Operating temperature range: -40C to +85C ADM1490E packages Narrow body, 8-lead SOIC 8-lead MSOP ADM1491E packages Narrow-body, 14-lead SOIC 10-lead MSOP
FUNCTIONAL BLOCK DIAGRAMS
VCC
ADM1490E
A RO R B Z DI D Y
07430-001
GND
Figure 1.
VCC
ADM1491E
A RO RE DE Z DI D
07430-002
APPLICATIONS
RS-485/RS-422 interfaces Industrial field networks High data rate motor control Multipoint data transmission systems Single-ended-to-differential signal conversion
R B
Y GND
Figure 2.
GENERAL DESCRIPTION
The ADM1490E/ADM1491E are RS-485/RS-422 transceivers with 8 kV ESD protection and are suitable for high speed, fullduplex communication on multipoint transmission lines. In particular, the ADM1490E/ADM1491E are designed for use in motor control applications requiring communications at data rates up to 16 Mbps. The ADM1490E/ADM1491E are designed for balanced transmission lines and comply with TIA/EIA-485-A-98. The devices each have a 12 k receiver input impedance for unit load RS485 operation, allowing up to 32 nodes on the bus. The differential transmitter outputs and receiver inputs feature electrostatic discharge circuitry that provides protection to 8 kV using the human body model (HBM). The ADM1490E/ADM1491E operate from a single 5 V power supply. Excessive power dissipation caused by bus contention or output shorting is prevented by short-circuit protection and thermal circuitry. Short-circuit protection circuits limit the
Rev. B
Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners.
maximum output current to 250 mA during fault conditions. A thermal shutdown circuit senses if the die temperature rises above 150C and forces the driver outputs into a high impedance state under this condition. The receiver of the ADM1490E/ADM1491E contains a fail-safe feature that results in a logic high output state if the inputs are unconnected (floating). The ADM1490E/ADM1491E feature extremely fast and closely matched switching times. Minimal driver propagation delays permit transmission at data rates up to 16 Mbps, and low skew minimizes EMI interference. The ADM1490E/ADM1491E are fully specified over the commercial and industrial temperature ranges. The ADM1490E is available in two packages: a narrow body, 8-lead SOIC and an 8-lead MSOP. The ADM1491E is also available in two packages: a narrow body, 14-lead SOIC and a 10-lead MSOP.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 www.analog.com Fax: 781.461.3113 (c)2008-2009 Analog Devices, Inc. All rights reserved.
ADM1490E/ADM1491E TABLE OF CONTENTS
Features .............................................................................................. 1 Applications ....................................................................................... 1 Functional Block Diagrams ............................................................. 1 General Description ......................................................................... 1 Revision History ............................................................................... 2 Specifications..................................................................................... 3 Timing Specifications .................................................................. 4 Absolute Maximum Ratings............................................................ 5 Thermal Resistance ...................................................................... 5 ESD Caution .................................................................................. 5 Pin Configurations and Function Descriptions ........................... 6 Typical Performance Characteristics ..............................................7 Test Circuits ........................................................................................9 Theory of Operation ...................................................................... 10 Truth Tables................................................................................. 10 ESD Transient Protection Scheme ........................................... 10 Applications Information .............................................................. 12 Differential Data ......................................................................... 12 Cable and Data Rate ................................................................... 12 Typical Applications ................................................................... 12 Outline Dimensions ....................................................................... 14 Ordering Guide .......................................................................... 15
REVISION HISTORY
7/09--Rev. A to Rev. B Added ADM1490E, 8-Lead SOIC, and 8-Lead MSOP ....... Universal Changes to Table 4 ..................................................................................... 5 Added Figure 8; Renumbered Sequentially .......................................... 6 Changes to Table 5 ..................................................................................... 6 Changes to Typical Applications Section ............................................ 12 Changes to Figure 28 ............................................................................... 12 Added Figure 29 ....................................................................................... 13 Updated Outline Dimensions ............................................................... 14 Changes to Ordering Guide................................................................... 15 2/09--Rev. 0 to Rev. A Change to Table 9 ........................................................................... 11 12/08--Revision 0: Initial Version
Rev. B | Page 2 of 16
ADM1490E/ADM1491E SPECIFICATIONS
4.75 V VCC 5.25 V; all minimum/maximum specifications apply over the entire recommended operation range, unless otherwise noted. All typical specifications are at TA = 25C, VCC = 5.0 V, unless otherwise noted. Table 1.
Parameter SUPPLY CURRENT Outputs Enabled Outputs Disabled DRIVER Differential Outputs Differential Output Voltage, Loaded Symbol ICC1 ICC2 Min Typ 1.2 0.8 Max 2.0 1.5 Unit mA mA Test Conditions Outputs unloaded, digital inputs = VCC or GND Outputs unloaded, digital inputs = VCC or GND
|VOD2| |VOD3| |VOD2| VOC |VOC| IO IO IOS VIL VIH II
2.0 1.5 1.5
|VOD| for Complementary Output States Common-Mode Output Voltage |VOC| for Complementary Output States Output Leakage Current (Y, Z) Output Short-Circuit Current Logic Inputs DE, RE, DI Input Low Voltage Input High Voltage Input Current RECEIVER Differential Inputs Differential Input Threshold Voltage Input Voltage Hysteresis Input Current (A, B) Line Input Resistance Logic Outputs Output Voltage Low Output Voltage High Short-Circuit Current Three-State Output Leakage Current
5.0 5.0 5.0 0.2 3.0 0.2 100 250 0.8
-100
V V V V V V A A mA V V A
RL = 100 (RS-422), see Figure 21 RL = 54 (RS-485), see Figure 21 -7 V VTEST +12 V, see Figure 22 RL = 54 or 100 , see Figure 21 RL = 54 or 100 , see Figure 21 RL = 54 or 100 , see Figure 21 DE = 0 V, VDD = 0 V or 5 V, VIN = 12 V DE = 0 V, VDD = 0 V or 5 V, VIN = -7 V -7 V < VOUT < +12 V DE, RE, DI DE, RE, DI DE, RE, DI
2.0 -1
+1
VTH VHYS II RIN VOL VOH IOZR
-0.2 30
+0.2 1.0
-0.8 12
30 0.4
V mV mA mA k V V mA A
-7 V < VCM < +12 V VCM = 0 V VCM = 12 V VCM = -7 V -7 V VCM +12 V IOUT = +4.0 mA, VA - VB = -0.2 V IOUT = -4.0 mA, VA - VB = +0.2 V VCC = 5.25 V, 0.4 V < VOUT < 2.4 V
4.0 85 1
Rev. B | Page 3 of 16
ADM1490E/ADM1491E
TIMING SPECIFICATIONS
TA = -40C to +85C. Table 2.
Parameter DRIVER Maximum Data Rate Propagation Delay Driver Output Skew Rise Time/Fall Time Enable Time Disable Time RECEIVER Propagation Delay Skew |tPLH - tPHL| Enable Time Disable Time Symbol Min 16 tDPLH, tDPHL tSKEW tDR, tDF tZH, tZL tHZ, tLZ tPLH, tPHL tSKEW tZH, tZL tHZ, tLZ 11 0.5 8 17 2 15 20 20 20 2 13 13 Typ Max Unit Mbps ns ns ns ns ns ns ns ns ns Test Conditions
RL = 54 , CL = 100 pF, see Figure 23 and Figure 3 RL = 54 , CL = 100 pF, see Figure 23 and Figure 3, tSKEW = |tDPLH - tDPHL| RL = 54 , CL = 100 pF, see Figure 23 and Figure 3 RL = 110 , CL = 50 pF, see Figure 24 and Figure 5 RL = 110 , CL = 50 pF, see Figure 24 and Figure 5 CL = 15 pF, see Figure 25 and Figure 4 CL = 15 pF, see Figure 25 and Figure 4 RL = 1 k, CL = 15 pF, see Figure 26 and Figure 6 RL = 1 k, CL = 15 pF, see Figure 26 and Figure 6
12 0.4
Timing Diagrams Switching Characteristics
VCC VCC/2 0V VCC/2
VCC DE 0.5VCC
0.5VCC
0V
tDPLH
Z
1/2VO VO
tDPHL
tZL
2.3V
tLZ
Y, Z
VOL + 0.5V
VOL
Y
tZH
Y, Z
2.3V
tHZ
VOH
07430-011
VOH - 0.5V 0V
+VO VDIFF -VO
90% POINT
VDIFF = V(Y) - V(Z)
90% POINT
10% POINT
10% POINT
tDR
tDF
07430-009
Figure 3. Driver Propagation Delay Rise/Fall Timing
Figure 5. Driver Enable/Disable Timing
0.7VCC
A-B
0V
0V
RE
0.5VCC
0.5VCC 0.3VCC
tPLH
tPHL
VOH
RO
tZL
1.5V OUTPUT LOW
tLZ
VOL + 0.5V VOL
RO
1.5V
07430-010
tSKEW = |tPLH - tPHL|
1.5V VOL
tZH
OUTPUT HIGH RO 0V 1.5V
tHZ
VOH
07430-012
VOH - 0.5V
Figure 4. Receiver Propagation Delay Timing
Figure 6. Receiver Enable/Disable Timing
Rev. B | Page 4 of 16
ADM1490E/ADM1491E ABSOLUTE MAXIMUM RATINGS
TA = 25C, unless otherwise noted. Table 3.
Parameter VCC to GND Digital I/O Voltage (DE, RE) Driver Input Voltage (DI) Receiver Output Voltage (RO) Driver Output/Receiver Input Voltage (A, B, Y, Z) Operating Temperature Range Storage Temperature Range ESD (HBM) on A, B, Y, and Z Rating -0.3 V to +7 V -0.3 V to VCC + 0.3 V -0.3 V to VCC + 0.3 V -0.3 V to VCC + 0.3 V -9 V to +14 V -40C to +85C -55C to +150C 8 kV
THERMAL RESISTANCE
JA is specified for the worst-case conditions, that is, a device soldered in a circuit board for surface-mount packages. Table 4. Thermal Resistance
Package Type 8-Lead SOIC 14-Lead SOIC 8-Lead MSOP 10-Lead MSOP JA 121 86 133 133 Unit C/W C/W C/W C/W
ESD CAUTION
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Rev. B | Page 5 of 16
ADM1490E/ADM1491E PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
ADM1491E
NC 1
14 VCC 13 VCC 12 A
ADM1490E
VCC RO DI GND
1 2 3 4 8
RO 2 RE 3 DE 4
ADM1491E
RO 1 RE 2 DE 3
07430-013
A B
07430-034
TOP VIEW (Not to Scale)
7 6 5
1
TOP VIEW 11 B (Not to Scale) 10 Z DI 5
9 8
10 VCC 9
A B
07430-015
GND 6
Y NC
Z Y
GND 7
DI 4 GND 5
TOP VIEW (Not to Scale)
8 7 6
Z Y
NC = NO CONNECT
Figure 7. 8-Lead MSOP and 8-Lead SOIC Pin Configuration
Figure 8. 14-Lead, Narrow Body SOIC Pin Configuration
Figure 9. 10-Lead MSOP Pin Configuration
Table 5. Pin Function Descriptions
Pin No. 8-Lead SOIC, 8-Lead MSOP N/A 1 2 N/A1 N/A1 14-Lead SOIC 1 2 3 4 10-Lead MSOP N/A1 1 2 3 Mnemonic NC RO RE DE Description No Connect. This pin is available on the 14-lead SOIC only. Receiver Output. Receiver Output Enable. A low level enables the receiver output, whereas a high level places the receiver output in a high impedance state. Driver Output Enable. A logic high enables the differential driver outputs, A and B, whereas a logic low places the differential driver outputs in a high impedance state. Driver Input. When the driver is enabled, a logic low on DI forces Pin A low and Pin B high, whereas a logic high on DI forces Pin A high and Pin B low. Ground. Ground. This pin is available on the 14-lead SOIC only. No Connect. This pin is available on the 14-lead SOIC only. Noninverting Driver Output Y. Inverting Driver Output Z. Inverting Receiver Input B. Noninverting Receiver Input A. Power Supply (5 V 5%). Power Supply (5 V 5%). This pin is available on the 14-lead SOIC only.
3 4 N/A1 N/A1 5 6 7 8 1 N/A1
1
5 6 7 8 9 10 11 12 13 14
4 5 N/A1 N/A1 6 7 8 9 10 N/A1
DI GND GND NC Y Z B A VCC VCC
N/A indicates not applicable.
Rev. B | Page 6 of 16
ADM1490E/ADM1491E TYPICAL PERFORMANCE CHARACTERISTICS
35 0.50 0.45 30
OUTPUT CURRENT (mA)
OUTPUT VOLTAGE (V)
25
0.40 0.35 0.30 0.25 0.20
20 15
10
5
07430-016
0 0 0.25 0.50 0.75 1.00 1.25 OUTPUT VOLTAGE (V) 1.50 1.75 2.00
0.15 -50
-25
0 25 TEMPERATURE (C)
50
75
85
Figure 10. Output Current vs. Receiver Output Low Voltage
0
Figure 13. Receiver Output Low Voltage vs. Temperature (IOUT = 8 mA)
80 70
-5 60
OUTPUT CURRENT (mA)
-10
OUTPUT CURRENT (mA)
50 40 30 20 10
-15
-20
-25 0 3.75 4.00 4.25 4.50 OUTPUT VOLTAGE (V) 4.75 5.00
07430-017
0
0.5
1.0
1.5 2.0 2.5 3.0 OUTPUT VOLTAGE (V)
3.5
4.0
4.5
Figure 11. Output Current vs. Receiver Output High Voltage
4.75
Figure 14. Output Current vs. Driver Differential Output Voltage
3.00 2.95
4.70
OUTPUT VOLTAGE (V)
OUTPUT VOLTAGE (V)
2.90 2.85 2.80 2.75 2.70
4.65
4.60
4.55 2.65
07430-018
4.50 -50
-25
0 25 TEMPERATURE (C)
50
75
85
2.60 -50
-25
0 25 TEMPERATURE (C)
50
75
85
Figure 12. Receiver Output High Voltage vs. Temperature (IOUT = 8 mA)
Figure 15. Driver Differential Output Voltage vs. Temperature (RL = 56.3 )
Rev. B | Page 7 of 16
07430-021
07430-020
-30 3.50
-10
07430-019
ADM1490E/ADM1491E
80 70 OUTPUT CURRENT (mA) 60 50 40 30 20 10
07430-022
1
3
07430-032
0 0 0.5 1.0 1.5 2.0 2.5 OUTPUT VOLTAGE (V) 3.0 3.5 4.0
CH1 5V CH3 2V
CH2 2V
M200ns
A CH1
1.6V
Figure 16. Output Current vs. Driver Output Low Voltage
0 -10
Figure 19. Unloaded Driver Differential Outputs
OUTPUT CURRENT (mA)
-20 -30 -40 -50 -60 -70 -80 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 OUTPUT VOLTAGE (V) 4.0 4.5 5.0
07430-023
1
3
07430-033
CH1 5V CH3 2V
CH2 2V
M200ns
A CH1
1.6V
Figure 17. Output Current vs. Driver Output High Voltage
1.30 1.25 1.20
OUTPUT CURRENT (mA)
Figure 20. Loaded Driver Differential Outputs (RL Differential = 54 , CL = 100 pF)
DRIVER ENABLED
1.15 1.10 1.05 1.00 0.95 0.90 0.85 0.80 -50 -25 0 25 TEMPERATURE (C) 50 75 85
07430-024
DRIVER DISABLED
Figure 18. Output Current vs. Temperature
Rev. B | Page 8 of 16
ADM1490E/ADM1491E TEST CIRCUITS
Y DI Z
VOD2 RL 2
Y
RL 2
VOUT VCC
VOC
DI
07430-003
RL 110
07430-006
S1 Z
CL 50pF
S2
DE
Figure 21. Driver Voltage Measurements
Figure 24. Driver Enable/Disable Timing
Y DI Z
VOD3 60
375
A
07430-004
B
CL
Figure 22. Driver Voltage Measurements
Figure 25. Receiver Propagation Delay
+1.5V
07430-007
375 V TEST
RE
VOUT
VCC
S1 RL RE S2
07430-008
Y
DI RL
CL
07430-005
-1.5V CL
VOUT
Z
CL
RE
Figure 23. Driver Propagation Delay
Figure 26. Receiver Enable/Disable Timing
Rev. B | Page 9 of 16
ADM1490E/ADM1491E THEORY OF OPERATION
The ADM1490E/ADM1491E are RS-422/RS-485 transceivers that operate from a single 5 V 5% power supply. The ADM1490E/ ADM1491E are intended for balanced data transmission and comply with both TIA/EIA-485-A and TIA/EIA-422-B. Each device contains a differential line driver and a differential line receiver and is suitable for full-duplex data transmission. The input impedance of the ADM1490E/ADM1491E is 12 k, allowing up to 32 transceivers on the differential bus. A thermal shutdown circuit prevents excessive power dissipation caused by bus contention or by output shorting. This feature forces the driver output into a high impedance state if, during fault conditions, a significant temperature increase is detected in the internal driver circuitry. The receiver contains a fail-safe feature that results in a logic high output state if the inputs are unconnected (floating). The ADM1490E/ADM1491E feature very low propagation delay, ensuring maximum baud rate operation. The balanced driver ensures distortion-free transmission. Another important specification is a measure of the skew between the complementary outputs. Excessive skew impairs the noise immunity of the system and increases the amount of electromagnetic interference (EMI).
ESD TRANSIENT PROTECTION SCHEME
The ADM1490E/ADM1491E use protective clamping structures on their inputs and outputs to clamp the voltage to a safe level and dissipate the energy present in ESD (electrostatic). The protection structure achieves ESD protection up to 8 kV human body model (HBM).
ESD Testing
Two coupling methods are used for ESD testing: contact discharge and air gap discharge. Contact discharge calls for a direct connection to the unit being tested; air gap discharge uses a higher test voltage but does not make direct contact with the unit under test. With air discharge, the discharge gun is moved toward the unit under test, developing an arc across the air gap; therefore, the term air discharge. This method is influenced by humidity, temperature, barometric pressure, distance, and rate of closure of the discharge gun. The contact discharge method, though less realistic, is more repeatable and is gaining acceptance and preference over the air gap method. Although very little energy is contained within an ESD pulse, the extremely fast rise time, coupled with high voltages, can cause failures in unprotected semiconductors. Catastrophic destruction can occur immediately because of arcing or heating. Even if catastrophic failure does not occur immediately, the device can suffer from parametric degradation, resulting in degraded performance. The cumulative effects of continuous exposure can eventually lead to complete failure.
HIGH VOLTAGE GENERATOR C1 R2 DEVICE UNDER TEST
TRUTH TABLES
Table 6. Abbreviations in Truth Tables
Letter H I L X Z Description High level Indeterminate Low level Irrelevant High impedance (off )
Table 7. Transmitting
DE H H L Inputs DI H L X Z L H Z Outputs Y H L Z
Figure 27. ESD Generator
Table 8. Receiving
RE L L L L H Inputs A-B +0.2 V -0.2 V -0.2 V A - B +0.2 V Inputs open X Output RO H L I H Z
I/O lines are particularly vulnerable to ESD damage. Simply touching or plugging in an I/O cable may result in a static discharge that can damage or destroy the interface product connected to the I/O port. It is, therefore, extremely important to have high levels of ESD protection on the I/O lines. The ESD discharge can induce latch-up in the device under test. Therefore, it is important to conduct ESD testing on the I/O pins while power is applied to the device. This type of testing is more representative of a real-world I/O discharge in which the equipment is operating normally when the discharge occurs.
Rev. B | Page 10 of 16
07430-025
NOTES 1. THE ESD TEST METHOD USED IS THE HUMAN BODY MODEL (8kV) WITH R2 = 1500 AND C1 = 100pF.
ADM1490E/ADM1491E
100% 90%
IPEAK
36.8% 10%
07430-026
tRL
tDL
TIME (t)
Figure 28. Human Body Model ESD Current Waveform
Table 9. ADM1490E/ADM1491E ESD Test Results
ESD Test Method Human Body Model Input/Output Pins 8 kV Other Pins 4 kV
Rev. B | Page 11 of 16
ADM1490E/ADM1491E APPLICATIONS INFORMATION
DIFFERENTIAL DATA
Differential data transmission reliably transmits data at high rates over long distances and through noisy environments. Differential transmission nullifies the effects of ground shifts and noise signals that appear as common-mode voltages on the line. There are two main standards approved by the Electronics Industries Association (EIA) that specify the electrical characteristics of transceivers used in differential data transmission. The RS-422 standard specifies data rates of up to 10 MBaud and line lengths of up to 4000 feet. A single driver can drive a transmission line with as many as 10 receivers. The RS-485 standard addresses true multipoint communications. This standard meets or exceeds all of the requirements of RS-422, and it allows as many as 32 drivers and 32 receivers to connect to a single bus. An extended common-mode range of -7 V to +12 V is defined. The most significant difference between the RS-422 and the RS-485 is that the drivers with RS-485 can be disabled, allowing more than one driver to be connected to a single line, with as many as 32 drivers connected to a single line. Only one driver should be enabled at a time, but the RS-485 standard contains additional specifications to guarantee device safety in the event of line contention.
CABLE AND DATA RATE
Twisted pair is the transmission line of choice for RS-485 communications. Twisted pair cable tends to cancel commonmode noise and causes cancellation of the magnetic fields generated by the current flowing through each wire, thereby reducing the effective inductance of the pair. An RS-485 transmission line can have as many as 32 transceivers on the bus. Only one driver can transmit at a time, but multiple receivers may be enabled simultaneously. As with any transmission line, it is important to minimize reflections. This can be achieved by terminating the extreme ends of the line using resistors equal to the characteristic impedance of the line. Keep stub lengths of the main line as short as possible. A properly terminated transmission line appears purely resistive to the driver.
TYPICAL APPLICATIONS
Figure 29 shows a typical configuration for a full-duplex pointto-point application using the ADM1490E. Figure 30 shows a typical configuration for a full-duplex multipoint application using the ADM1491E. To minimize reflections, the lines must be terminated at the receiving end in its characteristic impedance, and stub lengths off the main line must be kept as short as possible.
VCC
VCC VCC
ADM1490E
RO R
A B Z
Y
ADM1490E
D DI
RT
VCC
Z B
RT
DI
D
Y
A
R
RO
GND
GND
NOTES 1. MAXIMUM NUMBER OF NODES = 32.
Figure 29. Typical Point-to-Point Full-Duplex Application
Rev. B | Page 12 of 16
07430-027
ADM1490E/ADM1491E
MAXIMUM NUMBER OF NODES = 32 MASTER A RO RE DE DI D Z Y R B
VCC
SLAVE Y
RT
VCC
D Z
DI DE
B
RE R RO
RT
A
ADM1491E
A SLAVE B Z Y A B Z Y SLAVE
ADM1491E
ADM1491E
R D
R D
ADM1491E
NOTES 1. RT IS EQUAL TO THE CHARACTERISTIC IMPEDANCE OF THE CABLE.
Figure 30. Typical RS-485 Full-Duplex Application
Rev. B | Page 13 of 16
07430-028
RO
RE
DE
DI
RO
RE
DE
DI
ADM1490E/ADM1491E OUTLINE DIMENSIONS
8.75 (0.3445) 8.55 (0.3366)
14 1 8 7
4.00 (0.1575) 3.80 (0.1496)
6.20 (0.2441) 5.80 (0.2283)
1.27 (0.0500) BSC 0.25 (0.0098) 0.10 (0.0039) COPLANARITY 0.10 0.51 (0.0201) 0.31 (0.0122)
1.75 (0.0689) 1.35 (0.0531) SEATING PLANE
0.50 (0.0197) 0.25 (0.0098) 8 0 0.25 (0.0098) 0.17 (0.0067) 1.27 (0.0500) 0.40 (0.0157)
45
COMPLIANT TO JEDEC STANDARDS MS-012-AB CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS (IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
Figure 31. 14-Lead Standard Small Outline Package [SOIC_N] Narrow Body (R-14) Dimensions shown in millimeters and (inches)
3.10 3.00 2.90 3.10 3.00 2.90 PIN 1 0.50 BSC 0.95 0.85 0.75 0.15 0.05 0.33 0.17 COPLANARITY 0.10 COMPLIANT TO JEDEC STANDARDS MO-187-BA 1.10 MAX 8 0 0.80 0.60 0.40
10 6
5.15 4.90 4.65
1
5
SEATING PLANE
0.23 0.08
Figure 32. 10-Lead Mini Small Outline Package [MSOP] (RM-10) Dimensions shown in millimeters
Rev. B | Page 14 of 16
060606-A
ADM1490E/ADM1491E
5.00 (0.1968) 4.80 (0.1890)
8
5 4
4.00 (0.1574) 3.80 (0.1497)
1
6.20 (0.2441) 5.80 (0.2284)
1.27 (0.0500) BSC 0.25 (0.0098) 0.10 (0.0040) COPLANARITY 0.10 SEATING PLANE
1.75 (0.0688) 1.35 (0.0532)
0.50 (0.0196) 0.25 (0.0099) 8 0 0.25 (0.0098) 0.17 (0.0067) 1.27 (0.0500) 0.40 (0.0157)
45
0.51 (0.0201) 0.31 (0.0122)
COMPLIANT TO JEDEC STANDARDS MS-012-A A CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS (IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
Figure 33. 8-Lead Standard Small Outline Package [SOIC_N] Narrow Body (R-8) Dimensions shown in millimeters and (inches)
3.20 3.00 2.80
3.20 3.00 2.80
8
5
1
5.15 4.90 4.65
4
PIN 1 0.65 BSC 0.95 0.85 0.75 0.15 0.00 0.38 0.22 COPLANARITY 0.10 1.10 MAX 8 0 0.80 0.60 0.40
0.23 0.08 SEATING PLANE
COMPLIANT TO JEDEC STANDARDS MO-187-AA
Figure 34. 8-Lead Mini Small Outline Package [MSOP] (RM-8) Dimensions shown in millimeters
ORDERING GUIDE
Model ADM1490EBRZ 1 ADM1490EBRZ-REEL71 ADM1490EBRMZ1 ADM1490EBRMZ-REEL71 ADM1491EBRZ1 ADM1491EBRZ-REEL71 ADM1491EBRMZ1 ADM1491EBRMZ-REEL71
1
Temperature Range -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C
012407-A
Package Description 8-Lead Standard Small Outline Package, Narrow Body [SOIC_N] 8-Lead Standard Small Outline Package, Narrow Body [SOIC_N] 8-Lead Mini Small Outline Package [MSOP] 8-Lead Mini Small Outline Package [MSOP] 14-Lead Standard Small Outline Package, Narrow Body [SOIC_N] 14-Lead Standard Small Outline Package, Narrow Body [SOIC_N] 10-Lead Mini Small Outline Package [MSOP] 10-Lead Mini Small Outline Package [MSOP]
Package Option R-8 R-8 RM-8 RM-8 R-14 R-14 RM-10 RM-10
Branding
F0E F0E
F0D F0D
Z = RoHS Compliant Part.
Rev. B | Page 15 of 16
ADM1490E/ADM1491E NOTES
(c)2008-2009 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D07430-0-7/09(B)
Rev. B | Page 16 of 16

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